Substrate film for semiconductor-manufacturing tapes
TW202637384APending Publication Date: 2026-09-16C I TAKIRON CORP
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Patent Information
- Application Number
- TW115104367
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-02-10
- Filing Date
- 2026-02-04
- Publication Date
- 2026-09-16
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Abstract
The substrate film (1) for semiconductor manufacturing tape has at least a functional layer (2), the functional layer (2) contains polybutene, ionomer and olefin elastomer, the content of polybutene relative to the total content of the functional layer is more than 10% by mass and less than 80% by mass, the content of ionomer relative to the total content of the functional layer (2) is more than 10% by mass and less than 80% by mass, and the content of olefin elastomer relative to the total content of the functional layer (2) is more than 5% by mass and less than 50% by mass. A substrate film (1) for semiconductor-manufacturing tape comprises at least a functional layer (2). and 80 mass % or less, and the content of the olefin-based elastomer with respect to the total content of the functional layer (2) is 5 mass % or more and 50 mass % or less.
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