Powdered diamond film module and manufacturing method of powdered diamond film

Abstract

A powdered diamond film assembly and a method for manufacturing the powdered diamond film are disclosed. The powdered diamond film assembly is suitable for removing heat energy from a target object. The powdered diamond film assembly includes a powdered diamond film. The powdered diamond film is suitable for placement on the target object and for removing heat energy from the target object. The powdered diamond film has a diamond layer and a dielectric layer. The thickness of the diamond layer is between 0.01 μm and 500 μm, and the diamond layer is composed of a plurality of closely spaced diamond powder particles, each of which has a particle size between 0.003 μm and 55 μm. The dielectric layer is formed directly on the top surface of the diamond layer along a top-bottom direction. The thickness of the dielectric layer is between 0.1 μm and 500 μm, and the dielectric layer is suitable for contacting the target object and is thermally conductive. The powdered diamond film is obtained by directly placing the diamond powder particles in a mounting component and compacting them, thus allowing for large-area production without size limitations.

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