Ultra-thin glass substrate processing method, ultra-thin glass substrate processing device and temporary ultra-thin glass carrier assembly

Abstract

The present invention provides an ultra-thin glass substrate processing method, an ultra-thin glass substrate processing device and an ultra-thin glass temporary carrier assembly. The ultra-thin glass substrate processing device includes a substrate carrying module, an adhesive material providing module, a glass bonding module, an adhesive material curing module and a glass processing module. The substrate carrying module is configured to carry a temporary carrying substrate. The adhesive material providing module is configured to provide a reversible adhesive layer on the temporary carrier substrate. The glass bonding module is configured to bond an ultra-thin glass substrate having a thickness of less than

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