Support for glass substrates and laminates using this technology

TW202637502APending Publication Date: 2026-09-16NIPPON ELECTRIC GLASS CO LTD
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Patent Information

Application Number
TW115106053
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2017-12-13
Filing Date
2018-06-21
Publication Date
2026-09-16

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Abstract

The present invention relates to a support glass substrate and a laminated substrate using the same, characterized in that the average linear thermal expansion coefficient is above 30×10-7 / ℃ and below 55×10-7 / ℃ in a temperature range of 30 to 380℃, and the Young's modulus is above 80 GPa.
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