Methods for manufacturing glass plates, supporting glass substrates, laminates, laminates, and semiconductor packaging

Abstract

A supporting glass substrate with a predetermined coefficient of thermal expansion and few glass defects is provided. The supporting glass substrate, used to support a processed substrate, comprises, in molar percentage, 60-75% SiO2, 5-20% Al2O3, 1-10% B2O3, 1-8% MgO, 1-4.9% CaO, 0-5.4% SrO, and 0-3.6% BaO, and has an average coefficient of thermal expansion of less than 35 × 10⁻⁷ / ℃ in a temperature range of 20℃ to 260℃.