Method for manufacturing heat dissipation structure of composite material

TW202637516APending Publication Date: 2026-09-16CMTEK CO LTD
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Patent Information

Application Number
TW114108028
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-03-05
Publication Date
2026-09-16

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Abstract

A method for manufacturing a heat dissipation structure of a composite material includes the following steps. The first step is providing a rigid porous carrier. The rigid porous carrier is made of a hard material including silicon carbide. The next step is performing a metal vapor infiltration treatment on the rigid porous carrier. The metal vapor infiltration treatment includes vaporizing a melt of a highly thermally conductive metal material to produce a vapor mixture that penetrates into pores of the rigid porous carrier. Therefore, the pores in the rigid porous carrier can be fully filled with the highly thermally conductive metal material, so as to improve thermal performance.
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