Inhibitor composition, inhibitor pattern formation method, compound, acid generating agent, acid diffusion control agent, and polymer compound
TW202637531APending Publication Date: 2026-09-16TOKYO OHKA KOGYO CO LTD
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Patent Information
- Application Number
- TW114149830
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-20
- Filing Date
- 2025-12-18
- Publication Date
- 2026-09-16
Abstract
This invention employs a resist composition that generates acid upon exposure and alters the solubility of the developer due to the acid's action, and comprises a compound with a cation represented by general formula (c0). In the formula, R01 and R02 independently represent aryl, alkyl, or alkenyl groups, each potentially having substituents. R01 and R02 can also be bonded together to form a ring with the sulfur atom in the formula. R03 represents a substituent. k is an integer from 0 to 3. Based on this resist composition, high sensitivity and improved / reduced roughness in microlithography can be achieved, thereby suppressing defect formation.
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