Composition, method of treating metal-containing film by using the composition, and method of manufacturing electronic device by using the composition

TW202637538APending Publication Date: 2026-09-16SAMSUNG ELECTRONICS CO LTD
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Patent Information

Application Number
TW114152012
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-01-17
Filing Date
2025-12-30
Publication Date
2026-09-16

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Abstract

Provided are a composition, a method of treating a metal-containing film by using the composition, and a method of manufacturing an electronic device by using the composition. The composition may include an oxidizing agent, an ammonium-based buffer, and an etching controller. The etching controller may include a compound represented by Formula
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