Prepreg, metal-clad laminate, printed circuit board and semiconductor package

Abstract

A prepreg exhibiting low thermal expansion, a metal-clad laminate with low thermal expansion, a printed circuit board having the aforementioned metal-clad laminate, and a semiconductor package having the aforementioned printed circuit board are provided. Specifically, the aforementioned prepreg comprises a resin composition or a semi-cured form of the aforementioned resin composition, wherein the resin composition contains (A) a bismaleimide compound, wherein the nitrogen atoms of the two maleimide groups of the aforementioned (A) bismaleimide compound are bonded by organic groups, and the aforementioned organic groups have three aromatic hydrocarbon groups. none

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