Composition for copper electroplating comprising a grain refiner
TW202637551APending Publication Date: 2026-09-16BASF SE
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Patent Information
- Application Number
- TW114148676
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-16
- Filing Date
- 2025-12-11
- Publication Date
- 2026-09-16
Abstract
The present invention provides a composition for depositing copper on a semiconductor substrate, the composition comprising: (a) copper ions; (b) a grain refiner of formula G1a, G1b, or G1c or salts thereof; (c) a complexing agent; and (d) optionally a buffer or a base to adjust the pH to a pH of from
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