Manufacturing methods for components, modified substrates, multilayers, and electronic devices

Abstract

This invention provides a composition, a method for manufacturing a modified substrate, a method for manufacturing a multilayer, and a method for manufacturing an electronic device. The composition can form a film capable of sufficiently suppressing film formation due to atomic layer deposition even under harsh conditions such as high temperature during atomic layer deposition. The composition of this invention is used to form a film on a substrate that suppresses film formation due to atomic layer deposition. It comprises compound A, which has a structure represented by formula (A) and functional groups bonded to or adsorbed onto the substrate.