Methods for manufacturing polyimide precursors or polyamide-imide precursors, methods for manufacturing resin compositions, resin compositions, polyimide precursors or polyamide-imide precursors, transfer films, cured materials, laminates, methods for manufacturing cured materials, and semiconductor devices.

TW202637625APending Publication Date: 2026-09-16FUJIFILM CORP
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Patent Information

Application Number
TW114149762
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-12-10
Filing Date
2025-12-17
Publication Date
2026-09-16

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Abstract

A method for manufacturing a polyimide precursor or a polyamide-imide precursor, comprising the following steps in sequence: (A) reacting an anhydride derivative with a trichloro compound represented by general formula (1) as described in the specification in the presence of a tertiary amine to generate a compound represented by general formula (2) or a compound represented by general formula (3) as described in the specification; and (B) reacting the compound represented by general formula (2) or the compound represented by general formula (3) as described in the specification with a compound having two or more amine groups.
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