Photosensitive resin composition, resin curing film and image display device
TW202637656APending Publication Date: 2026-09-16RESONAC CORP
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Patent Information
- Application Number
- TW114149415
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-08-07
- Filing Date
- 2025-12-16
- Publication Date
- 2026-09-16
Abstract
A photosensitive resin composition comprising copolymer (A-1), copolymer (A-2), photopolymerization initiator (C), and solvent (D); copolymer (A-1) comprises hydroxyl groups, a unit having a blocked isocyanate group (a), a unit having a nitrogen atom (b), and a unit having an acid group (c); the unsaturated group equivalent of copolymer (A-2) is 30~3000 g / mol.
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