Method for manufacturing circuit connectors using a mixed bonding curable resin composition

TW202637659APending Publication Date: 2026-09-16RESONAC CORP
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Patent Information

Application Number
TW114129573
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-08-08
Filing Date
2025-08-04
Publication Date
2026-09-16

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Abstract

A curable resin composition for mixed bonding comprises: a maleimide compound having a maleimide group, and a reactive component different from the maleimide compound. The reactive component comprises a styrene-based compound having a reactive group formed by removing one or more hydrogen atoms bonded to a benzene ring from the compound represented by formula (I): R1 and R2 are each independently a hydrogen atom or an alkyl group having 1 to 3 carbon atoms.
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