Polyoxymethylene resin, resin compositions, cured materials, films, coating liquid compositions, prepregs, and electronic substrates

Abstract

The polyoxymethylene resin of this invention comprises a structural unit represented by the following formula (UN1) and end structures having vinyl groups, and having the aforementioned end structures at both ends. In the above formula (UN1), Ux is a single bond or a divalent group, R1 and R2 are each independently a substituent, m is 0, 1, 2, 3, or 4, n is 0, 1, 2, 3, or 4, and * denotes a bond.