Semiconductor adhesive tape, method for manufacturing semiconductor adhesive tape, method for manufacturing semiconductor wafer with adhesive layer, and method for manufacturing semiconductor device.

Abstract

An example of a semiconductor adhesive tape is disclosed. The semiconductor adhesive tape 10 includes a substrate 4, an adhesive layer 3 disposed on the substrate 4, and an adhesive layer (film adhesive) 2 disposed on the adhesive layer. The arithmetic mean roughness Sa of the surface of the adhesive layer 3 on the side farther from the substrate 4 is less than 0.012 μm. Although the semiconductor adhesive tape 10 is an integral adhesive tape, the surface of the adhesive layer after the adhesive tape is peeled off exhibits good flatness.

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