Epoxy resin composition, cured material, semiconductor device, and method for manufacturing semiconductor device.

TW202637674APending Publication Date: 2026-09-16NAMICS CORPORATION
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Patent Information

Application Number
TW114144640
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-11-18
Filing Date
2025-11-17
Publication Date
2026-09-16

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Abstract

An epoxy resin composition with good adhesion is provided. Furthermore, a cured form of the above-mentioned epoxy resin composition, a semiconductor device having the above-mentioned cured form, and a method for manufacturing the same are provided. An epoxy resin composition comprises: an epoxy resin (A), a curing agent (B), and an inorganic filler (C), wherein the content of naphthalene-type epoxy resin relative to the epoxy resin (A) (100% by mass) is 51% by mass or more, and the content of inorganic filler (C) is 40-90% by mass.
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