Semiconductor film adhesives, adhesive tapes, and semiconductor devices and manufacturing methods thereof

TW202637679APending Publication Date: 2026-09-16RESONAC CORP
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Patent Information

Application Number
TW114149735
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-19
Filing Date
2025-12-17
Publication Date
2026-09-16

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Abstract

This invention discloses a film-like adhesive for semiconductors, comprising a thermosetting resin, a curing agent, a thermoplastic resin, and a filler. The thermosetting resin includes an epoxy resin that is solid at 25°C. Based on the total amount of the semiconductor film-like adhesive, the combined content of the epoxy resin and thermoplastic resin that are solid at 25°C is 40% by mass or more. The mass ratio of the epoxy resin content to the thermoplastic resin content is 3.0 or more.
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