Photosensitive resin compositions, and resin-coated films, resin-coated metal foils, wiring boards, and semiconductor devices using the same.

Abstract

One aspect of this invention relates to a photosensitive resin composition comprising a cationic polymerizable compound (A), a cationic polymerizable compound (B), and a photocationic polymerization initiator (C). The cationic polymerizable compound (A) has a silsesquioxane structure, and the cationic polymerizable compound (B) has at least one structure selected from at least one of the structures shown in formulas (1-1) and (1-2), a fluorinated structure, and a polysiloxane structure. The photocationic polymerization initiator (C) comprises: a first photocationic polymerization initiator (C1) having a conjugate acid strength greater than or equal to that of HSbF6 and having a first anionic portion; and a second photocationic polymerization initiator (C2) having a conjugate acid strength lower than that of HSbF6 and having a second anionic portion. The content of the photocationic polymerization initiator (C) is 0.1 parts by mass or more and 5 parts by mass or less relative to the total 100 parts by mass of the cationic polymerizable compound (A) and the cationic polymerizable compound (B).