Difunctional vinyl compounds, their components and hardeners
TW202637697APending Publication Date: 2026-09-16NIPPON STEEL CHEM & MATERIAL CO LTD
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Patent Information
- Application Number
- TW115107769
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-10
- Filing Date
- 2026-03-04
- Publication Date
- 2026-09-16
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Figure TWG2TA001077287_001 
Figure TWG2TA001077287_002
Abstract
The purpose of this invention is to provide a compound with excellent solvent solubility, heat resistance, thermal decomposition stability, thermal conductivity, low dielectric constant, low dielectric loss tangent, and excellent flame retardancy, as well as a resin composition containing the compound with curable properties. A difunctional vinyl compound is represented by the following general formula (1). In formula (1), R1 to R7 independently represent hydrogen atoms, fluorine atoms, alkoxy groups, or monovalent hydrocarbon groups having 1 to 6 carbon atoms, and X independently represents the structure shown in formula (2), benzonitrile structure, diphenylsulfonyl structure, xylene structure, or -(CH2)m-, where m is 3 to 10 and n is 1 to 15.
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