Method for manufacturing photosensitive resin composition and hardened embossed pattern

TW202637710APending Publication Date: 2026-09-16ASAHI KASEI KOGYO KABUSHIKI KAISHA

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Patent Information

Application Number: TW114149798
Authority / Receiving Office: TW · TW
Patent Type: Applications
Current Assignee / Owner
Priority Date: 2024-12-19
Filing Date: 2025-12-18
Publication Date: 2026-09-16

Application Information

Patent Timeline

19 Dec 2024

Priority

18 Dec 2025

Application

TW114149798

16 Sep 2026

Publication

TW202637710A

IPC: C08G73/12; G03F7/004; G03F7/038; G03F7/16; G03F7/20; G03F7/40; H10W70/00; H10W70/09; H10W70/60; H10W70/655; H10W72/00; H10W72/20; H10W72/29; H10W72/90; H10W74/01; H10W74/10; H10W90/00; H10W90/10; H10W90/20

Inventors: 清水建樹

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Abstract

This invention provides a photosensitive resin composition for use in panel-level encapsulation processes, comprising: (A) a polyimide precursor: 100 parts by weight, (B) a photopolymerization initiator: 0.5 to 20 parts by weight, (C) an organic solvent: 300 to 800 parts by weight, and (X) a thermal alkali generating agent: 0.1 to 40 parts by weight, with a viscosity of 0.02 to 1.5 Pa·s measured by an E-type viscometer at 23°C.

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Patent Information

Abstract