Thermosetting resin compositions, prepregs, resin films, laminates, multilayer boards, printed circuit boards, and semiconductor packages

Abstract

This invention provides a thermosetting resin composition that can suppress poor forming of the insulating layer. The invention further provides a prepreg, a resin film, a laminate, a laminated board, a printed circuit board, and a semiconductor package, all obtained using this thermosetting resin composition. Specifically, the thermosetting resin composition contains (A) a maleimide compound and (B) an inorganic filler material with a volume average particle size of 2.5 μm or more.

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