Adhesive composition, laminate, method for manufacturing laminate, and method for manufacturing semiconductor substrate or electronic device substrate after processing.

Abstract

This invention provides a laminate, etc., comprising: a support substrate, a semiconductor substrate or an electronic device substrate, and an adhesive layer disposed between the semiconductor substrate or the electronic device substrate and the support substrate; and when the semiconductor wafer serving as the semiconductor substrate or electronic device substrate is peeled off from the support substrate, the peeling interface is the interface between the semiconductor wafer and the adhesive layer. This invention also provides an adhesive composition for forming an adhesive layer disposed between the support substrate and the semiconductor substrate or electronic device substrate, wherein the adhesive composition contains an adhesive component (A) cured by a hydrosilane reaction and a silane coupling agent having an ethylene unsaturated group.

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