Transfer film, cured film, semiconductor package, pattern forming method, and method for manufacturing semiconductor package

Abstract

The present invention aims to provide a transfer film comprising a composition layer having a low coefficient of linear expansion and excellent adhesion to copper, as well as a curing film, semiconductor packaging, patterning method, and method for manufacturing the curing film. The transfer film of the present invention comprises a temporary support and a composition layer, wherein the composition layer comprises an organic polysiloxane, the organic polysiloxane having at least one selected from the group consisting of T units and D units, and may have at least one selected from the group consisting of Q units and M units, the composition layer may have a compound represented by formula (1) (compound (1)), the sum of the product of the parameter X derived from formula (X) based on each unit constituting the organic polysiloxane and the molar fraction of each unit relative to the molar amount of each unit and the molar amount of compound (1), and the sum of the product of the parameter X derived from formula (X) based on compound (1) and the molar fraction of compound (1) relative to the molar amount of each unit and the molar amount of compound (1) is 17 MPa1 / 2 or more.

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