Prepreg, metal-clad laminate, printed circuit board, and semiconductor package
TW202637731APending Publication Date: 2026-09-16RESONAC CORP
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Patent Information
- Application Number
- TW114148135
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-09-22
- Filing Date
- 2025-12-09
- Publication Date
- 2026-09-16
Abstract
The present invention is a prepreg comprising a curable resin material and a fiber substrate, wherein the dielectric loss tangent (10 GHz, 25 °C) of the cured prepreg is less than 0.0020, and the average coefficient of thermal expansion in the thickness direction (Z direction) of the cured prepreg in the temperature range of 30 to 120 °C is less than 30 ppm / °C.
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