Prepregs, multilayer boards, printed circuit boards and semiconductor packages
TW202637741APending Publication Date: 2026-09-16RESONAC CORP
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Patent Information
- Application Number
- TW114146870
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-11-29
- Filing Date
- 2025-12-01
- Publication Date
- 2026-09-16
Abstract
This invention provides a prepreg that maintains low dielectric properties and exhibits high reflow heat resistance. Furthermore, this invention provides a multilayer board, printed circuit board, and semiconductor package using the aforementioned prepreg. Specifically, the aforementioned prepreg is a prepreg comprising: a thermosetting resin composition containing a thermosetting resin (A) and a leveling agent (X) having alkyl groups having 1,000 to 100,000 carbon atoms; and a fiber substrate.
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