Resin composition, sheet-shaped material, printed wiring board, and semiconductor device

TW202637748APending Publication Date: 2026-09-16RESONAC CORP
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Patent Information

Application Number
TW114136475
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-07
Filing Date
2025-09-23
Publication Date
2026-09-16

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Abstract

A resin composition comprising: a thermoplastic elastomer having styrene-derived structural units and being solid at 25°C; a liquid compound having styrene-derived structural units and being liquid at 25°C; a crosslinking agent; and an inorganic filler. A resin composition includes: a thermoplastic elastomer having a structural unit derived from a styrene-based compound and being solid at 25℃; a liquid compound having a structural unit derived from a styrene-based compound and being liquid at 25℃; a crosslinking agent; and an inorganic filler.
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