Resin composition, resin film, layered body, method of producing layered body, printed wiring board and semiconductor package
TW202637751APending Publication Date: 2026-09-16RESONAC CORP
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Patent Information
- Application Number
- TW114145543
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-11-22
- Filing Date
- 2025-11-21
- Publication Date
- 2026-09-16
Abstract
A resin composition, comprising a thermosetting resin and an acrylic polymer.
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