Photocurable resin composition, metho of producing patterned cured product, patterned cured product, and electronic component

TW202637763APending Publication Date: 2026-09-16HD MICROSYSTEMS LTD
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Patent Information

Application Number
TW115105722
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-17
Filing Date
2026-02-12
Publication Date
2026-09-16

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Abstract

A photocurable resin composition, comprising a polyimide precursor having a polymerizable unsaturated bond, and a solvent, the solvent comprising N, N-dimethylpropionamide.
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