Polishing slurry, polishing method, manufacturing method of parts, and manufacturing method of semiconductor parts.
TW202637791APending Publication Date: 2026-09-16RESONAC CORP
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Patent Information
- Application Number
- TW115117998
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-02-02
- Filing Date
- 2024-01-26
- Publication Date
- 2026-09-16
Abstract
A polishing slurry for polishing undoped silicate glass, having a pH of 3.0 or higher. A polishing method comprising the step of polishing a surface of a workpiece containing undoped silicate glass using the aforementioned polishing slurry. A method for manufacturing a part, comprising obtaining the part using a workpiece polished by the aforementioned polishing method.
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