Etchant composition for etching metal nitride layer and method of forming pattern using the same

TW202637815APending Publication Date: 2026-09-16DONGWOO FINE CHEM CO LTD
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Patent Information

Application Number
TW115105705
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-20
Filing Date
2026-02-12
Publication Date
2026-09-16

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Abstract

This invention relates to an etching solution composition for etching a metal nitride layer, and a method for forming a pattern thereon. The etching solution composition comprises an oxidant, a fluorinated compound, an additive containing a carbonate-based compound, and the balance being water. The method for forming the pattern comprises: forming a metal pattern on a substrate; forming a barrier layer comprising a metal nitride and covering the metal pattern on the substrate; and etching the barrier layer using the etching solution composition.
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