Transfer laminate and method for manufacturing transfer laminate
TW202637855APending Publication Date: 2026-09-16OIKE & CO LTD
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Patent Information
- Application Number
- TW114145062
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-11
- Filing Date
- 2025-11-19
- Publication Date
- 2026-09-16
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Abstract
[Problem] A transfer printed laminate used for forming a circuit board and showing good stripping property even when no heat load is applied during the circuit formation process, and a method for manufacturing the transfer printed laminate are provided. [Solution] A transfer printed laminate sequentially comprises a substrate, a conductive layer, a stripping layer, and a conductive auxiliary layer. The conductive layer comprises copper; the stripping layer comprises an alloy of nickel and chromium or an alloy of nickel and copper; and the conductive auxiliary layer comprises copper. The maximum value of the oxygen concentration, determined by depth-direction compositional analysis using X-ray photoelectron spectroscopy in the thickness direction of the stripping layer, is
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