Copper alloy plastic processing materials and parts for electronic and electrical machinery
TW202637856APending Publication Date: 2026-09-16MITSUBISHI MATERIALS CORP
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Patent Information
- Application Number
- TW114151212
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-27
- Filing Date
- 2025-12-24
- Publication Date
- 2026-09-16
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Figure TWG2TA001076945_001 
Figure TWG2TA001076945_002
Abstract
It is characterized by having an Fe content of 0.08% to 0.17% by mass, a P content of 0.025% to 0.06% by mass, a residual component of Cu and unavoidable impurities, a conductivity of 75% IACS or higher, a Vickers hardness of 130 HV or higher at room temperature, and a Vickers hardness of 40 HV or higher at 400°C.
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