Evaporation equipment and substrate electroplating equipment

TW202637869APending Publication Date: 2026-09-16ACM RES (SHANGHAI) INC
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Patent Information

Application Number
TW115103163
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-12
Filing Date
2026-01-27
Publication Date
2026-09-16

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Abstract

This application provides an evaporation apparatus and a substrate electroplating equipment. The evaporation apparatus is used to evaporate liquid in a storage tank and includes: a gas supply assembly for supplying protective gas to the storage tank; a gas circulation pipeline having an extraction end and an exhaust end, respectively connected to the storage tank; an exhaust assembly for allowing gas in the storage tank to enter the gas circulation pipeline from the extraction end and return to the storage tank from the exhaust end; a condensation and drainage assembly including a cooling element and a drainage pipeline, the cooling element for condensing the gas entering the gas circulation pipeline from the extraction end, and the drainage pipeline for discharging the liquid water generated after the gas is condensed; and a temperature control assembly for regulating the gas after being treated by the condensation and drainage assembly, so that the gas discharged from the exhaust end returns to the storage tank at a predetermined temperature. By recycling the protective gas, the consumption of protective gas is effectively reduced, thereby maintaining the concentration and level of the liquid in the storage tank while making the production process more energy-efficient and environmentally friendly.
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