Semiconductor manufacturing equipment

TW202637892APending Publication Date: 2026-09-16KIOXIA CORP
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
TW114125271
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-14
Filing Date
2025-07-03
Publication Date
2026-09-16

Smart Images

  • Figure TWG2TA001076187_001
    Figure TWG2TA001076187_001
  • Figure TWG2TA001076187_002
    Figure TWG2TA001076187_002
  • Figure TWG2TA001076187_003
    Figure TWG2TA001076187_003
Patent Text Reader

Abstract

The present invention provides a semiconductor manufacturing apparatus capable of suppressing the backflow of unwanted byproducts contained in exhaust gas. The semiconductor manufacturing apparatus comprises: a piping through which exhaust gas from a process chamber flows in a first direction; and a plurality of traps spaced apart on the inner circumferential surface of the piping in the first direction. Each of the plurality of traps has: a recess on the inner circumferential surface recessed towards the outer side of the piping; and a shielding surface extending from the edge of the recess into the piping along a second direction intersecting the first direction.
Need to check novelty before this filing date? Find Prior Art