Epitaxial growth method from nucleation layer
TW202637906APending Publication Date: 2026-09-16SOITEC SA
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Patent Information
- Application Number
- TW114151719
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-30
- Filing Date
- 2025-12-29
- Publication Date
- 2026-09-16
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Abstract
This invention relates to an epitaxial growth method starting from a nucleation layer. A stack (1) is provided, which sequentially comprises, along a direction called stacking direction (Z): a substrate (10), preferably silicon; an insulating layer (20); and a layer containing a semiconductor, called a nucleation layer (30). The insulating layer (20) has a portion not covered by the nucleation layer (30), called an exposed portion (25). At least a portion of the exposed portion (25) of the insulating layer is then roughened, called a roughened portion (26), and epitaxial growth is then performed starting from the nucleation layer (30).
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