Opening mechanism, semiconductor equipment and cavity opening method

TW202637949APending Publication Date: 2026-09-16ADVANCED MICRO FAB EQUIP INC CHINA
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Patent Information

Application Number
TW115107239
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-10
Filing Date
2026-02-26
Publication Date
2026-09-16

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Abstract

This invention relates to a cap-opening mechanism, a semiconductor device, and a method for opening the cavity therein. The semiconductor device includes a reaction chamber and a top cover, the top cover being used to seal the reaction chamber. The cap-opening mechanism includes: a power unit, including a rotating shaft, for providing a flipping force to the top cover to open or close the reaction chamber; a connecting structure, including a first end and a second end, the first end being fixedly connected to the top cover, and the second end being connected to the rotating shaft; and a resistance support structure disposed between the second end of the connecting structure and the rotating shaft. When the top cover flips so that its center of gravity passes directly above the rotating shaft, the gravitational torque of the top cover reverses and drives a resisted relative sliding at the connection between the connecting structure and the rotating shaft, thereby mitigating the impact of the gravitational torque. This invention can effectively mitigate the impact of the gravitational torque generated by the sudden drop of the top cover on the rotating shaft and the reaction chamber, avoiding mechanical damage caused by the impact.
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