Vapor chamber for a heat dissipation substrate and heat dissipation substrate for a power semiconductor module including the same and a manufacturing method thereof
TW202637989APending Publication Date: 2026-09-16LX SEMICON CO LTD
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Patent Information
- Application Number
- TW115109031
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-14
- Filing Date
- 2026-03-11
- Publication Date
- 2026-09-16
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Abstract
A heat dissipation substrate vapor chamber according to an embodiment may include a frame part, a wick structure disposed inside the frame part; and a tube disposed on a side of the frame part. And the tube may include a first tube and a second tube.
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