Wafer inspection equipment

Abstract

This invention provides a wafer inspection apparatus, comprising: an interferometer having a beam splitter and a collimator, the interferometer being used to measure surface parameters of a wafer; and an optical path folding element disposed between the beam splitter and the collimator, the optical path folding element being used to fold the optical path between the beam splitter and the collimator to reduce the space occupied by the optical path between the beam splitter and the collimator. The wafer inspection apparatus provided by this invention, by placing an optical path folding element between the beam splitter and the collimator of the interferometer, folds the optical path between the beam splitter and the collimator without affecting the accuracy and throughput of the wafer inspection apparatus, thereby reducing the space occupied by the optical path between the beam splitter and the collimator, and consequently reducing the footprint of the entire wafer inspection apparatus and the cost of constructing the apparatus.

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