Warpage detection device
Patent Information
- Application Number
- TW114114214
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-11
- Filing Date
- 2025-04-15
- Publication Date
- 2026-09-16
- Estimated Expiration
- 2045-04-14
AI Technical Summary
Existing methods for measuring substrate warpage, such as the Shadow Moire measurement system and pin gauge, are costly, time-consuming, and risk damaging the substrate, while the Shadow Moire system imposes design restrictions and the pin gauge has high error and labor costs.
A warpage detection device with a light-emitting platform, light-shielding member, and photosensitive sensors that automatically analyze substrate warpage without direct contact, allowing for quick, accurate, and cost-effective detection.
The device provides rapid, low-cost, and precise warpage analysis with minimal substrate damage risk, overcoming size limitations and reducing development dilemmas in substrate design.
Smart Images

Figure TWG2TA001076069_001 
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Abstract
Description
[Technical Field]
[0001] This invention relates to a detection technology, and more particularly to a warping detection device that facilitates the detection of warping in sheet materials. [Previous Technology]
[0002] In order to meet the requirements of high integration and miniaturization of semiconductor devices, ensuring the flatness and accuracy of the carrier board used to carry the chip is crucial for normal operation and reliability in the semiconductor product manufacturing process, especially the inspection of warpage at the time of shipment. As the demand for carrier boards and production volume increase, rapid screening methods are needed to improve inspection efficiency.
[0003] The mainstream method for measuring the warpage of a substrate is to use the Shadow Moire measurement system. It uses a vertical light source signal to illuminate the substrate under test, and then receives and analyzes the reflected signal to calculate the warpage of the substrate. However, the Shadow Moire measurement system is expensive, making it difficult to reduce the testing cost. In addition, the analysis time is long, and there are special restrictions on the size of the substrate under test. As a result, the design of the substrate must be compatible with the Shadow Moire measurement system, thus creating a dilemma in the development of substrate design.
[0004] Therefore, the industry has adopted the cheaper pin gauge, which measures the degree of warpage manually by means of a gap gauge. However, this method has a larger error and higher labor and time costs. When the gap gauge is in direct contact with the front side (wiring / crystal placement surface) of the substrate, it is easy to damage the front side of the substrate, which greatly increases the risk of substrate loss.
[0005] Therefore, how to overcome the various problems of the aforementioned conventional technology has become an urgent issue to be addressed. [Summary of the Invention]
[0006] In view of the various deficiencies of the prior art, the present invention provides a warpage detection device, comprising: a working platform, which is a light-emitting platform having a bearing surface for placing and illuminating at least one target object such as a sheet material; a light-shielding member erected on the bearing surface and having a light-shielding area adjacent to the bearing surface; and a sensing group comprising at least one pair of photosensors configured corresponding to the light-shielding member for detecting light outside the light-shielding area.
[0007] In one specific embodiment, the work platform includes a platform body having the bearing surface and a light-emitting element disposed on another surface opposite to the bearing surface, and the platform body is made of a light-transmitting material so that the light-emitting element illuminates the target object.
[0008] In one specific embodiment, the warpage detection device may further include a limiting member disposed on the bearing surface and located on opposite sides of the bearing surface, respectively, so that the limiting member and the light-shielding member clamp the target object. For example, a track structure is disposed on the bearing surface to allow the limiting member to move linearly along the track structure. Furthermore, at least one correction member is disposed above the bearing surface to keep the surface of the limiting member parallel to the light-shielding member during the movement of the limiting member.
[0009] In one specific embodiment, the light-shielding member is a plate made of light-transmitting material, and the light-shielding area of the light-shielding member is formed with a strip of opaque material.
[0010] In one specific embodiment, the shading area has a target height relative to the bearing surface, and the target height is the maximum permissible warpage of the target object.
[0011] In one embodiment, the sensing group further includes at least one indicator that is communicatively connected to the photosensor. For example, the indicator is a lamp type.
[0012] In a specific embodiment, when the target object appears outside the light-blocking area, the target object will circle the light-transmitting area, so that the light illuminating the target object by the work platform passes through the light-transmitting area, and the photosensitive sensor detects the light in the light-transmitting area, which means that the warping degree of the target object is too large and it is unqualified.
[0013] As can be seen from the above, the warpage detection device of the present invention can screen the degree of warpage of the target object mainly by means of the cooperation of the light shield and the photosensitive element. It is not only simple in structure and easy to build, but also uses the existing specification of the sensing group, which is conducive to purchasing the sensing group cheaply to reduce the detection cost.
[0014] Furthermore, by means of the design of the photosensitive sensor, it is possible to quickly analyze whether the degree of warpage of the target object meets the requirements. Therefore, compared with the prior art, the warpage detection device of the present invention adopts automated analysis, which not only has a very short analysis time to greatly reduce time costs, but also has very small errors, thus meeting the requirements for quickly screening whether the degree of warpage of the product is qualified.
[0015] Furthermore, by means of the movable design of the limiting member, the position of the limiting member can be adjusted to match the size of the target object. Therefore, compared with the conventional Shadow Moire measurement system, the warpage detection device of the present invention can detect the size of various carrier plates, so as to avoid the problem of development dilemma of carrier plate design caused by size limitations.
[0016] In addition, the limiting member only contacts the side of the target object, so it will not damage the front of the target object. Therefore, compared with conventional plug gauges, the warpage detection device of the present invention can reduce the risk of damage to the carrier plate. [Simplified Explanation of the Diagram]
[0047] Figure 1 is a three-dimensional perspective view of the warp detection device of the present invention.
[0048] Figure 2 is a side view of the warp detection device of the present invention in a qualified state during use.
[0049] Figure 3 is a side view of the warp detection device of the present invention in a non-conforming state during use.
Implementation Method
[0017] The following describes the implementation of the present invention through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.
[0018] It should be understood that the structures, proportions, sizes, etc., illustrated in the accompanying drawings of this specification are only used to complement the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not intended to limit the conditions under which the present invention can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportional relationships, or adjustments to the size, without affecting the effects and objectives that the present invention can produce, should still fall within the scope of the technical content disclosed in the present invention. At the same time, the terms used in this specification, such as "above," "below," "left," "right," "front," "rear," "first," "second," "one," "two," "five," etc., are only for the clarity of description and are not intended to limit the scope of the present invention. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of the present invention.
[0019] Figure 1 is a three-dimensional perspective view of the warpage detection device 1 of the present invention. As shown in Figure 1, the warpage detection device 1 is used for rapid screening of the warpage state of the board material in semiconductor manufacturing process. It includes a working platform 10 with a bearing surface 10a, a light shield 11 erected on the bearing surface 10a, and a sensor group 12 configured corresponding to the light shield 11.
[0020] In this embodiment, the warpage detection device 1 defines the front and rear directions (e.g., arrow direction X) and the left and right directions (e.g., arrow direction Y) based on the bearing surface 10a, and defines the direction perpendicular to the bearing surface 10a as the up and down directions (e.g., arrow direction Z). It should be understood that this orientation is used to illustrate the configuration of this embodiment and is not particularly limiting.
[0021] The work platform 10 is a light-emitting platform, and its bearing surface 10a is used to place and irradiate at least one target object 9, such as a plate.
[0022] In this embodiment, the work platform 10 includes a platform body 100 having the bearing surface 10a (the top surface as shown in the figure) and a light-emitting element 101 disposed on another surface opposite to the bearing surface 10a (the bottom surface as shown in the figure), so as to illuminate the target object 9 by means of the light-emitting element 101. For example, the light-emitting element 101 can emit uniform light to serve as a backlight source, and the platform body 100 is made of a light-transmitting material (such as a transparent material) to form a rectangular platform, which can not only homogenize the light source so that the light from the light-emitting element 101 can be uniformly dispersed and penetrate the platform body 100, but also has a heat dissipation function. In addition, the illumination area of the light-emitting element 101 can be controlled to be limited to the bearing surface 10a in front of the sensing group 12, or the platform body 100 behind the light-shielding member 11 can be made to prevent light from passing through, for example, by processing the platform body 100 to form an opaque material such as black material on the surface of the platform body 100 in the range of the light-shielding member 11.
[0023] Furthermore, a limiting member 13 is disposed on the bearing surface 10a, which, along with the light-shielding member 11, is located on opposite sides of the bearing surface 10a (the front and rear sides as shown in the figure), so that the limiting member 13 abuts against the target object 9, thereby pressing and fixing the target object 9 in place. For example, the limiting member 13 is a rectangular clamp made of light-transmitting material, which clamps the target object 9 together with the light-shielding member 11.
[0024] Furthermore, the limiting member 13 is movable, and it moves linearly toward the light-shielding member 11 in the direction of arrow X. For example, a track structure 14 can be configured on the bearing surface 10a so that the limiting member 13 moves linearly along the track structure 14.
[0025] Further, the track structure 14 includes at least one rail 140, which is disposed on the other opposite sides (left and right sides as shown in the figure) of the bearing surface 10a, and the limiting member 13 has a guide groove 130 corresponding to the rail 140, so that the rail 140 is engaged in the guide groove 130, allowing the rail 140 to slide relative to the guide groove 130. Preferably, the track structure 14 may include two support plates 141, which are mounted on the other opposite sides (left and right sides as shown in the figure), so that the four rails 140 as shown in the figure are disposed on the upper and lower edges of the support plates 141, and the guide grooves 130 are opened at the four corners of the limiting member 13 to connect the track structure 14, so as to smoothly move linearly back and forth and avoid wobbling during movement. For example, the support plate 141 is a rectangular plate made of light-transmitting material, and the rail 140 is a guide ridge.
[0026] In addition, at least one correction member 15 may be disposed above the bearing surface 10a to keep the surface of the limiting member 13 parallel to the light-shielding member 11 during the movement of the limiting member 13. For example, the correction member 15 is a right-angle bracket, which has one side forming a right angle disposed on a reference surface (such as on the bearing surface 10a or the support plate 141), and the other side forming a right angle abutting against the limiting member 13 to ensure that the limiting member 13 presses tightly against the target object 9.
[0027] The target object 9 mentioned above can be a wafer, a carrier board (such as a packaging substrate, wire bonding frame, silicon interposer or other carrier board, etc.) or other material, and there are no particular restrictions.
[0028] The light-shielding member 11 has a light-shielding area A adjacent to the bearing surface 10a, and the light-shielding area A has a target height H relative to the bearing surface 10a, as shown in FIG2, which is designed according to the maximum permissible warpage of the target object 9 that can be customized.
[0029] In this embodiment, the light-shielding member 11 is a rectangular plate made of light-transmitting material, and the support plate 141 is connected to its opposite sides. For example, the light-shielding member 11, the limiting member 13 and the support plate 141 form an accommodating space S, and one end (rear end) of the rail 140 can be fixed to the light-shielding member 11.
[0030] Furthermore, the light-shielding area A is formed on the light-shielding member 11 as a rectangular strip of opaque material, such as black material. For example, a scale line 110 can be formed next to the light-shielding area A (as shown in the figure, it is provided on the support plate 141) to quantify the detection results in order to distinguish the needs of different target objects 9 being screened.
[0031] The sensing group 12 includes at least one pair of photosensors 120 configured in response to the light-shielding member 11. The detection height L is higher than the target height H, as shown in FIG2, to detect light outside the light-shielding area A.
[0032] In this embodiment, the photosensor 120 is communicatively connected to a terminal computer (not shown), and in use, the light-blocking area A is located between the target object 9 and the photosensor 120. For example, in use, the target object 9 is located within the accommodating space S, while the photosensor 120 is located outside the accommodating space S.
[0033] Furthermore, the sensing range of the photosensitive sensor 120 corresponds to the distribution range of the light-blocking area A, so as to completely detect the light outside the light-blocking area A. For example, the light-blocking area A is configured with multiple (five) photosensitive sensors 120.
[0034] Furthermore, the sensing group 12 further includes at least one indicator 121, 122 that is communicatively connected to the photosensitive sensor 120. For example, the indicator 121, 122 is of the lamp type, which represents whether the warpage of the target object 9 is normal by means of the lamp being on / off. Further, the sensing group 12 includes two indicators 121, 122, which use different wavelengths of color for easy differentiation, so as to form more combinations of light signals (e.g., on / off, off / on, on / on, off / off) for screening target objects 9 that are qualified or unqualified in terms of warpage.
[0035] Therefore, in use, firstly, the light-emitting element 101, the photosensitive element 120 and the two indicators 121 and 122 are turned on, and in the initial state, the indicator light of one of the indicators 121 is lit up as the first indicator light, while the indicator light of the other indicator 122 is turned off as the second indicator light.
[0036] Next, the target object 9 is placed on the platform body 100 (or in the accommodating space S), so that the target object 9 is in an upward arched state, and one side (rear side) of the target object 9 is in close contact with the light shield 11, so that the light shielding area A is located between the target object 9 and the photosensitive sensor 120.
[0037] Then, the limiting member 13 is slowly moved along the track structure 14 toward the light shield 11, and at the same time the correction member 15 is used to ensure that the limiting member 13 is pushed toward the target object 9 at a parallel angle until the limiting member 13 contacts the target object 9 and clamps and fixes the target object 9.
[0038] Finally, the photosensitive sensor 120 performs a sensing action so that the user can read the status of the indicator lights 122.
[0039] In this embodiment, when the warping of the target object 9 is too large and fails to meet the requirements, a light-transmitting area E will appear above the light-blocking area A, circled by the arc-shaped projection of the side of the target object 9, as shown in Figure 3. The light illuminating the target object 9 by the light-emitting element 101 passes through the light-transmitting area E, so that the photosensitive element 120 captures the light of the target object 9 and the light-transmitting area E. At this time, the indicator lights of the indicators 122 remain unchanged, that is, the indicator light of the first indicator light (indicator 121) is still on, while the indicator light of the second indicator light (indicator 122) is still off. Therefore, the user can classify the target object 9 as a defective product.
[0040] Conversely, if the warping degree of the target object 9 meets the requirements and is qualified, the light-blocking area A will completely block the side arched projection of the target object 9, as shown in Figure 2, so that the photosensitive sensor 120 does not capture additional light patterns. At this time, the status of the indicator lights of the indicators 122 will change, that is, the indicator light of the first indicator light (indicator 121) will be turned off, and the indicator light of the second indicator light (indicator 122) will be lit. Therefore, the user can classify the target object 9 as a good product.
[0041] It should be understood that there are many variations of the indicator lights of the indicators 121 and 122, and they are not limited to those described above.
[0042] In summary, the warpage detection device 1 of the present invention can screen the degree of warpage of the target object 9 by means of the cooperation of the light shield 11 and the sensing group 12. It is not only simple in structure and easy to build, but also uses the existing specification sensing group 12, which is conducive to the cheap purchase of the sensing group 12 to reduce the detection cost.
[0043] Furthermore, by using the light detection results and light signal response of the sensing group 12, it is possible to quickly analyze whether the degree of warpage of the target object 9 meets the requirements. Therefore, compared with the prior art, the warpage detection device 1 of the present invention adopts automated analysis, which not only has a very short analysis time to greatly reduce time costs, but also has very small errors, thus meeting the requirements for quickly screening whether the degree of warpage of the product is qualified.
[0044] Furthermore, by means of the movable design of the limiting member 13, the position of the limiting member 13 can be adjusted to match the size of the target object 9. Therefore, compared with the conventional Shadow Moire measurement system, the warpage detection device 1 of the present invention can detect the size of various carrier plates, so as to avoid the problem of development dilemma of carrier plate design caused by size limitations.
[0045] In addition, the limiting member 13 only contacts the side of the target object 9 (such as the carrier plate), so it will not damage the front (i.e. the upper and lower surfaces) of the target object 9. Therefore, compared with the conventional pin gauge, the warpage detection device 1 of the present invention can reduce the risk of damage to the carrier plate.
[0046] The above embodiments are used to illustrate the principles and effects of the present invention, and are not intended to limit the present invention. Any person skilled in the art can modify the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be as set forth in the following claims.
Claims
1. A warpage detection device, comprising: The work platform is a light-emitting platform, which has a bearing surface for placing and illuminating at least one target object, such as a board. A light-shielding member is erected on the supporting surface and has a light-shielding area adjacent to the supporting surface; and The sensing group includes at least one pair of photosensors configured to be connected to the light-shielding member, which detect light outside the light-shielding area.
2. The warpage detection device as described in claim 1, wherein, The work platform includes a platform body having the bearing surface and a light-emitting element disposed on another surface opposite the bearing surface. The platform body is made of a light-transmitting material so that the light-emitting element illuminates the target object.
3. The warpage detection device as described in claim 1 further includes a limiting member disposed on the bearing surface and located on opposite sides of the bearing surface, such that the limiting member and the light shield clamp the target object.
4. The warpage detection device as described in claim 3, wherein, A track structure is configured on the bearing surface to allow the limiting member to move linearly along the track structure.
5. The warpage detection device as described in claim 4, wherein, At least one alignment member is disposed above the bearing surface to keep the surface of the limiting member parallel to the light-shielding member during the movement of the limiting member.
6. The warpage detection device as described in claim 1, wherein, The light-shielding component is a plate made of light-transmitting material, and the light-shielding area of the light-shielding component has a strip of opaque material.
7. The warpage detection device as described in claim 1, wherein, The shading area has a target height relative to the bearing surface, and the target height is the maximum permissible warpage of the target object.
8. The warpage detection device as described in claim 1, wherein, The sensor array further includes at least one indicator that is communicatively connected to the photosensitive sensor.
9. The warpage detection device as described in claim 8, wherein, The indicator is a light type.
10. The warpage detection device as described in claim 1, wherein, When the target object appears outside the shaded area, it will circle the light-transmitting area, allowing the light from the work platform to pass through the light-transmitting area. If the light sensor detects the light in the light-transmitting area, it means that the warping of the target object is too great and it is unqualified.
