Process control of semiconductor fabrication equipment using ultrasonic sensors

Abstract

A sensing arrangement coupled with semiconductor fabrication equipment, includes at least one waveguide and an ultrasonic transducer coupled to the waveguide configured to transmit ultrasonic signals onto the waveguide and to receive reflected ultrasonic signals from the waveguide. A controller is configured to monitor outputs of the sensing arrangement, the controller comprising logic configured to use outputs to determine one or both of a temperature of a fluid in the equipment, a level of a fluid in the equipment, and / or a temperature of a component of the equipment. The controller is configured to control, based on the monitored outputs, an operational parameter of the semiconductor fabrication equipment.

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