Automatic calibration method and apparatus for wafer positioning, charged particle beam device

Abstract

This invention discloses an automatic wafer position calibration method and apparatus, and a charged particle beam device. The automatic wafer position calibration method is used to automatically calibrate the position of a wafer on a sample stage. The automatic calibration method includes: acquiring edge contour data of the wafer and the ring electrode before the sample stage moves to the wafer observation position; acquiring calibration parameters for the wafer position based on the edge contour data; and adjusting the movement trajectory of the sample stage according to the calibration parameters to move the area to be observed on the wafer into the observable range of the observation instrument. This method can replace the commonly used OM alignment in traditional methods, shortening the alignment time and improving the throughput of the instrument.

Images