System for testing electronic device

TW202638049AActive Publication Date: 2026-09-16ADVANCED SEMICON ENG INC
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Patent Information

Application Number
TW114108370
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-03-06
Publication Date
2026-09-16
Estimated Expiration
2045-03-05

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Abstract

An embodiment of the present disclosure relates to a system for testing an electronic component, which includes a lower part and an upper part. The lower part is configured to support a device under test (DUT) and has a first electrical contact. It is designed to provide suction to the DUT, while the upper part is configured to apply pressure to the lower part against the DUT, thereby electrically connecting the first electrical contact to the DUT.
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Claims

1. A system for testing electronic devices, comprising: a lower portion configured to carry a device under test (DUT), the lower portion having a protective layer and a first electrical contact surrounding the protective layer, wherein the protective layer defines a first channel through the first electrical contact; and an upper portion; wherein the lower portion is configured to provide an attractive force to the DUT, and the upper portion is configured to provide a pressure to the DUT toward the lower portion, such that the first electrical contact is electrically connected to the DUT.

2. The system as described in claim 1, wherein the first channel is configured to switch between vacuum and non-vacuum states.

3. The system as described in claim 1, further comprising: A test board having a second electrical contact, wherein the attraction and the pressure cause the first electrical contact and the second electrical contact to form a temporary conductive connection.

4. The system as described in claim 3, wherein the test board has a second channel through the second electrical contact.

5. The system as described in claim 4, wherein the second channel is connected to the first channel.

6. The system as described in claim 3, further comprising: One side is disposed on the test plate and defines a space with the test plate to accommodate the lower part, the DUT, and the upper part.

7. The system as described in claim 1, wherein the lower portion includes a conductive rubber.

8. The system as described in claim 1, wherein the upper portion is spaced apart from the DUT to provide the pressure.

9. The system as described in claim 8, wherein the upper portion includes a third channel configured to provide a fluid between the upper portion and the DUT.

10. The system as described in claim 8, further comprising: One side portion includes a fourth channel configured to provide fluid between the upper portion and the DUT.