Probe pin and method of manufacturing the same
TW202638059APending Publication Date: 2026-09-16PT&K CO LTD
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Patent Information
- Application Number
- TW115121467
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-07-25
- Filing Date
- 2024-10-11
- Publication Date
- 2026-09-16
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Abstract
According to an embodiment of the present invention, a probe is used in a semiconductor testing apparatus for receiving electrical signals from a tester and inspecting a semiconductor wafer. The probe includes: a connection portion electrically connected to the tester; an elastic portion connected at one end to the connection portion and applying elastic force when the probe contacts the semiconductor wafer; and a contact portion connected at one end to the other end of the elastic portion, the other end of which contacts the semiconductor wafer. The cross-sections of the connection portion and the contact portion have rounded rectangular vertices, and the elastic portion extends in the length direction, is recessed in the width direction, and forms a bend in one or both directions.
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