Probe card and manufacturing method of silicon carbide thin film circuit board

Abstract

A probe card includes a printed circuit board and a silicon carbide film circuit board. The silicon carbide film circuit board includes a silicon carbide substrate, a plurality of layers of films, a plurality of circuits, a plurality of bonding pads and a plurality of probes. The silicon carbide substrate has a first surface and a second surface, the first surface of the silicon carbide substrate contacts the printed circuit board, the films are stacked on the second surface of the silicon carbide substrate, the circuits are formed inside the silicon carbide substrate and the films, and one end of the circuits is exposed to the upper film, the soldering pads are arranged at one end of the circuits, and the probes are welded to the soldering pads. Such that, the heat dissipation effect of the silicon carbide substrate is very good, so the heat transferred from the silicon carbide substrate to the printed circuit board is greatly reduced, preventing the printed circuit board from overheating and deforming.

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