Techniques to prevent underfill interference in photonic fiber couplers
TW202638103APending Publication Date: 2026-09-16LIGHTMATTER INC
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Patent Information
- Application Number
- TW114144349
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-11-13
- Filing Date
- 2025-11-13
- Publication Date
- 2026-09-16
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Abstract
Described herein are robust fiber-connection structures for photonic integrated circuits (PICs). These fiber connection structures enable efficient optical coupling between integrated waveguides defined near an edge of a PIC and corresponding optical fibers, thereby facilitating reliable edge coupling. The fiber-connection designs developed by the inventor improve upon conventional approaches by minimizing damage associated with die-sawing processes, reducing surface roughness and preventing underfill intrusion into the edge coupling region.
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