System-on-wafer and methods of forming the same
TW202638107APending Publication Date: 2026-09-16TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- TW114121045
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-04-17
- Filing Date
- 2025-06-05
- Publication Date
- 2026-09-16
Smart Images
Figure TWG2TA001076156_001 
Figure TWG2TA001076156_002 
Figure TWG2TA001076156_003
Abstract
A device includes an interposer, a package attached to a first side of the interposer, and a plurality of passive devices and external connectors attached to a second side of the interposer. The package includes an encapsulant and integrated circuit devices in the encapsulant. The interposer electrically connects the passive devices and external connectors to the integrated circuit devices. The external connectors are disposed outside a perimeter of the package in a top-down view.
Need to check novelty before this filing date? Find Prior Art