Workpiece bonding machine and workpiece bonding method

Abstract

The purpose of this invention is to provide a workpiece bonding machine and a workpiece bonding method that can solve problems arising in steps related to workpiece bonding. A workpiece bonding machine includes: a workpiece holding mechanism that, after peeling off one or both of a thin-plate workpiece held in a pair of holding plates under vacuum, opens the periphery of the workpiece to the atmosphere; and an actuator that is circumferentially arranged around a workpiece outer peripheral seal for use by a user to press the workpiece outer peripheral seal as a whole. The workpiece bonding machine is characterized by further including: a control unit that performs pressing control on the workpiece outer peripheral seal after the workpiece bonding operation under vacuum and before peeling off the workpiece, thereby solving the problem.

Images