Transducer circuit board and method for manufacturing the same

Abstract

A transducer circuit board and method for manufacturing the same are provided. The transducer circuit board includes a frame and a moving platform. The frame is placed around the transducer circuit. The moving platform is disposed in the frame. The moving platform includes a flexible board, a support board, a photoreceptor, a magnetic susceptible sheet, a coil layer, and a frame adhesive. The coil layer is perpendicularly projected on a first area on the support board, and the photoreceptor is perpendicularly projected a second area on the support board in which the first area overlapped the second area. The frame adhesive is placed between the flexible board and the support board, in which a cavity is formed between the flexible board and the support board and is surrounded by the frame adhesive. When the coil layer is energized, the coil layer generates a magnetic force and affects the movement of the magnetic susceptible sheet on the cavity to move the photoreceptor relative to the support board, which helps to improve the issue of jitter and vibration in the z-axis direction.

Description

[Technical Field]

[0001] This invention relates to a circuit board, and more particularly to a sensor circuit board and a method of manufacturing the same. [Previous Technology]

[0002] To improve the stability of camera lenses, a sensor-based image stabilization device is currently provided. However, most current camera lenses can only achieve image stabilization and vibration reduction along the x-axis and y-axis (e.g., horizontal direction). A good solution for image stabilization and vibration reduction along the z-axis (e.g., vertical direction) has not yet been found. In some situations, for example, when motorcyclists or delivery personnel have their phones mounted on motorcycle racks, the motorcycle engine vibrates and shakes vertically when driving over bumps or idling at red lights. This Z-axis vibration can easily damage the internal components of currently available mobile phones. [Summary of the Invention]

[0003] At least one embodiment of the present invention provides a sensor circuit board and a method for manufacturing the same, which helps to improve the jitter and vibration problem in the z-axis direction.

[0004] At least one embodiment of the present invention provides a sensor circuit board, including an outer frame and a moving stage. The outer frame is located around the sensor circuit board. The moving stage is disposed within the outer frame. The moving stage includes a flexible substrate, a support substrate, a photosensitive element, a magnetosensitive sheet, a coil layer, and a frame adhesive. The flexible substrate has a first upper surface and a first lower surface relative to the first upper surface. The support substrate has a second upper surface and a second lower surface relative to the second upper surface. The photosensitive element is disposed on the first upper surface. The magnetosensitive sheet is disposed on the first lower surface. The coil layer is disposed on the second upper surface, wherein the coil layer projects a first region perpendicularly onto the support substrate, and the photosensitive element projects a second region perpendicularly onto the support substrate, wherein the first region and the second region overlap. The frame adhesive is disposed between the flexible substrate and the support substrate, wherein a cavity is formed between the flexible substrate and the support substrate and is surrounded by the frame adhesive. When the coil layer is energized, the coil layer generates a magnetic force and causes the magnetosensitive sheet to move relative to the support substrate, thereby changing the distance between the photosensitive element and the support substrate.

[0005] At least one embodiment of the present invention provides a method for manufacturing a sensor circuit board, comprising: providing a flexible substrate having a first upper surface and a first lower surface relative to the first upper surface; providing a support substrate having a second upper surface and a second lower surface relative to the second upper surface; disposing a photosensitive element on the first upper surface; disposing a magnetosensitive sheet on the first lower surface; disposing a coil layer on the second upper surface, wherein the coil layer overlaps with the magnetosensitive sheet; forming a movable stage; disposing a frame adhesive between the flexible substrate and the support substrate, and surrounding the four edges of the movable stage; forming a cavity between the flexible substrate, the support substrate, and the frame adhesive; and disposing the movable stage within an outer frame.

[0006] Based on the above, the sensor circuit board consists of a magnetic sensing sheet, a coil layer and a cavity. When the coil layer is energized, the coil layer generates a magnetic force, which affects the movement of the magnetic sensing sheet in the cavity and drives the photosensitive element opposite to the magnetic sensing sheet, so that the photosensitive element moves relative to the supporting substrate.

Implementation Method

[0007] In the following text, in order to clearly present the technical features of this application, the dimensions (e.g., length, width, thickness, and depth) of the elements (e.g., layers, films, substrates, and regions) in the drawings will be enlarged proportionally, and the number of some elements will be reduced. Therefore, the description and explanation of the embodiments below are not limited to the number of elements in the drawings and the size and shape of the elements, but should cover the size, shape, and deviations of both caused by actual manufacturing processes and / or tolerances. For example, a flat surface shown in the drawings may have rough and / or non-linear characteristics, and an acute angle shown in the drawings may be rounded. Therefore, the elements presented in the drawings of this application are mainly for illustration and are not intended to accurately depict the actual shape of the elements, nor are they intended to limit the scope of the claims of this application.

[0008] It should be understood that although the terms "first," "second," "third," etc., in this disclosure may be used to describe various components, elements, areas, layers, parts, and / or segments, these components, elements, areas, layers, parts, and / or segments should not be limited by these terms. These terms are used only to distinguish one component, element, area, layer, part, or segment from another. Therefore, the first component, element, area, layer, part, or segment described below may be referred to as the second component, element, area, layer, part, or segment without departing from the teachings of this disclosure.

[0009] FIG1 is a top view of a sensor circuit board 100 according to at least one embodiment of the present invention. Referring to FIG1, the sensor circuit board 100 includes an outer frame 110 and a moving stage 130. The outer frame 110 is located around the periphery of the sensor circuit board 100. The moving stage 130 is disposed within the outer frame 110. The sensor circuit board 100 also includes a plurality of suspension wire frames 120 arranged concentrically around the moving stage 130 without directly contacting it. A plurality of first connectors 150 connect the moving stage 130 and the plurality of suspension wire frames 120, and a plurality of second connectors 155 connect the plurality of suspension wire frames 120 and the outer frame 110. The number of suspension wire frames 120 shown in FIG1 is three, but in other embodiments, there may be two or less or more than three, and it is not limited thereto.

[0010] Figures 2A and 2B are cross-sectional views of the movable stage 130 of Figure 1 along section line AA. Referring to Figure 2A, the movable stage 130 includes a flexible substrate 160, a support substrate 180, a photosensitive element 135, a magnetosensitive sheet 136, a coil layer 137, and a frame adhesive 140. The flexible substrate 160 has a first upper surface 161 and a first lower surface 162 relative to the first upper surface 161. The support substrate 180 has a second upper surface 182 and a second lower surface 184 relative to the second upper surface 182.

[0011] The flexible substrate 160 is flexible and can be bent. It can also be a flexible printed circuit (hereinafter referred to as FPC). The insulating material of the FPC can be polyimide (PI), thermoplastic polyimide (TPI), polyethylene terephthalate (PET) or polyethylene (PE), but is not limited to these.

[0012] The support substrate 180 can be a combination of a flexible substrate 160 and a rigid plate, or it can be a rigid plate directly. The rigid plate can be, for example, a metal plate or a printed circuit board (PCB). The metal plate can be, for example, stainless steel or copper.

[0013] A photosensitive element 135 is disposed on the first upper surface 161. A magnetic sensing sheet 136 is disposed on the first lower surface 162. A coil layer 137 is disposed on the second upper surface 182. The coil layer 137 projects a first region 186 vertically onto the supporting substrate 180, while the photosensitive element 135 projects a second region 188 vertically onto the supporting substrate 180, wherein the first region 186 and the second region 188 overlap. A frame adhesive 140 is disposed between the flexible substrate 160 and the supporting substrate 180, wherein a cavity 139 is formed between the flexible substrate 160 and the supporting substrate 180 and is surrounded by the frame adhesive 140.

[0014] The magnetic sensing sheet 136 exhibits ferromagnetism or ferrimagnetism, therefore, the constituent material of the magnetic sensing sheet 136 can be a ferromagnetic material such as iron, cobalt, or nickel, or a ferrite material, such as iron oxide, wherein the aforementioned ferrite material can be a ceramic material. The frame adhesive 140 may include an adhesive 142 and a resist ring 143. The adhesive 142 may be a prepreg. The resist ring 143 may be polyimide (PI).

[0015] Referring to Figure 2B, when the coil layer 137 is energized, the coil layer 137 generates a magnetic force, which affects the movement of the magnetoresistive sheet 136 on the cavity 139, thereby causing the photosensitive element 135 to move relative to the support substrate 180, which helps to improve the jitter and vibration problem in the z-axis direction. In other words, when the coil layer 137 is energized, the coil layer 137 generates a magnetic force and causes the magnetoresistive sheet 136 to move relative to the support substrate 180, thereby changing the distance between the photosensitive element 135 and the support substrate 180, which helps to improve the jitter and vibration in the z-axis direction (e.g., the vertical direction).

[0016] Figures 3A to 3C are cross-sectional schematic diagrams of a method for manufacturing a moving stage 130 of a sensor circuit board 100 (as shown in Figure 1) according to at least one embodiment of the present invention. Referring to Figure 3A, a flexible substrate 160 is provided, having a first upper surface 161 and a first lower surface 162 relative to the first upper surface 161. A magnetic sensing sheet 136 is disposed on the first lower surface 162. Referring to Figure 3B, a support substrate 180 is provided, having a second upper surface 182 and a second lower surface 184 relative to the second upper surface 182; a coil layer 137 is disposed on the second upper surface 182. Referring to Figure 3C, a moving stage 130 is formed. A frame adhesive 140 is disposed between the flexible substrate 160 and the support substrate 180, and surrounds the four edges (not shown) of the moving stage 130, wherein the projections of the coil layer 137 and the magnetic sensing sheet 136 overlap. A cavity 139 is formed between the flexible substrate 160, the support substrate 180, and the frame adhesive 140.

[0017] Figures 4A and 4B are enlarged schematic diagrams of the wire-stayed frame region B and region C of Figure 1. Figure 4A is an enlarged schematic diagram of the wire-stayed frame region B. Referring to Figure 4A, multiple grooves 122 exist between multiple wire-stayed frames 120. The multiple grooves 122 are arranged between multiple wire-stayed frames 120 and have multiple metal plating layers 124 on one side of the grooves 122. A protective film 190 covers the multiple grooves 122. The protective film 190 has multiple cuts 193, each cut along the direction of the groove 122, wherein circular holes 196 are formed at both ends of the groove 122. Figure 4B is an enlarged schematic diagram of the wire-stayed frame region C, which has the same structure as Figure 4A. The difference is that the direction of the grooves 122 in Figure 4A is the X-axis direction shown in Figure 1, while the direction of the grooves 122 in Figure 4B is the Y-axis direction shown in Figure 1.

[0018] Figures 5A to 5C are schematic cross-sectional views of a method for manufacturing the suspension frame 120 of the sensor circuit board 100 according to at least one embodiment of the present invention. The left view of Figures 5A to 5C is a cross-sectional view drawn along section line DD of the right view. The left end of the right view of Figures 5A to 5C can be one of the manufacturing methods of Figure 4B. The right end of the right view of Figures 5A to 5C can be one of the manufacturing methods of Figure 4A.

[0019] Referring to Figure 5A, the wire frame 120 (not shown) is composed of a flexible substrate 160. The steps of forming the flexible substrate 160 include providing a first flexible circuit structure 164, the first flexible circuit structure 164 having a first metal layer 166 and a second metal layer 167 opposite to the first metal layer 166. Providing a second flexible circuit structure 165, the second flexible circuit structure 165 having a third metal layer 168. Using an adhesive layer 170, the first flexible circuit structure 164 and the second flexible circuit structure 165 are bonded together, wherein the adhesive layer 170 is located between the second metal layer 167 and the second flexible circuit structure 165. The adhesive layer 170 can be an adhesive, a photocurable adhesive, or a thermocurable adhesive.

[0020] After the flexible substrate 160 is completed, a plurality of wire guides 120 (not shown) are then formed. The step of forming the plurality of wire guides 120 includes setting a plurality of metal-plated holes 121 on the flexible substrate 160. The hole walls (not shown) of the metal-plated holes 121 are plated with a metal plating layer 124. The method of forming the metal-plated holes 121 may include laser drilling, electroplating, and electroless electroplating.

[0021] Referring to Figure 5B, multiple trenches 122 are formed to connect multiple metal plating holes 121 (as shown in Figure 5A), and multiple hole walls (not shown) of each of the multiple metal plating holes 121 (as shown in Figure 5A) are retained on one side of the trench 122. In other words, each side of the multiple trenches 122 has multiple metal plating layers 124. The trenches 122 can be formed by laser ablation or wet chemical etching.

[0022] Referring to Figure 5C, a protective film 190 is applied to multiple grooves 122. Multiple slots 193 are cut along the direction of the grooves 122, and circular holes 196 are formed at both ends of each groove 122. The method for forming the slots 193 and the circular holes 196 can be laser drilling.

[0023] In summary, in the sensor circuit board 100 of at least one embodiment of the present invention, the magnetic force of the coil layer 137 and the magnetic sensing sheet 136 influences the movement of the magnetic sensing sheet 136 on the cavity 139, thereby driving the photosensitive element 135 relative to the magnetic sensing sheet 136 to move up and down relative to the support substrate 180. Therefore, compared with most current camera lenses that can only achieve image stabilization and vibration reduction along the x-axis and y-axis (e.g., the horizontal direction), the sensor circuit board 100 has the movement of the magnetic sensing sheet 136 along the z-axis, which helps to achieve image stabilization and vibration reduction in the z-axis direction (e.g., the vertical direction).

[0024] Although this application has disclosed various embodiments above, it is not intended to limit this application. The above outlines components of several embodiments to facilitate a better understanding of the inventive embodiments by those skilled in the art. Those skilled in the art should understand that they can design or modify other processes and structures based on the embodiments of this invention to achieve the same purpose and / or advantages as the embodiments described herein. Those skilled in the art should also understand that such equivalent processes and structures do not depart from the spirit and scope of this invention, and that various changes, substitutions, and replacements can be made without departing from the spirit and scope of this invention. Therefore, the scope of protection of this application shall be determined by the appended claims. [Simplified Explanation of the Diagram]

[0025] To make the above and other features, advantages and embodiments of the present invention more apparent and understandable, the detailed description of the accompanying drawings is as follows: FIG1 is a top view of a sensor circuit board according to at least one embodiment of the present invention. FIG2A and FIG2B are cross-sectional views of the moving stage of FIG1 along section line AA. FIG3A and FIG3C are cross-sectional schematic diagrams of a method for manufacturing the moving stage of the sensor circuit board according to at least one embodiment of the present invention. FIG4A and FIG4B are enlarged schematic diagrams of the suspension frame region B and suspension frame region C of FIG1. ​​FIG5A and FIG5C are cross-sectional schematic diagrams of a method for manufacturing the suspension frame of the sensor circuit board according to at least one embodiment of the present invention.

Claims

1. A sensor circuit board, comprising: An outer frame is located around the sensor circuit board; The system includes a movable stage disposed within the outer frame, comprising: a flexible substrate having a first upper surface and a first lower surface relative to the first upper surface; a support substrate having a second upper surface and a second lower surface relative to the second upper surface; a photosensitive element disposed on the first upper surface; a magnetic sensing sheet disposed on the first lower surface; a coil layer disposed on the second upper surface, wherein the coil layer projects a first region perpendicularly onto the support substrate, and the photosensitive element projects a second region perpendicularly onto the support substrate, wherein the first region overlaps with the second region; a frame adhesive disposed between the flexible substrate and the support substrate, wherein a cavity is formed between the flexible substrate and the support substrate and is surrounded by the frame adhesive; and when the coil layer is energized, the coil layer generates a magnetic force, causing the magnetic sensing sheet to move relative to the support substrate, thereby changing the distance between the photosensitive element and the support substrate; wherein the flexible substrate further includes: a first flexible circuit structure having a first metal layer and a second metal layer relative to the first metal layer; A second flexible circuit structure having a third metal layer; and an adhesive layer that attaches the first flexible circuit structure to the second flexible circuit structure and is located between the second metal layer and the second flexible circuit structure.

2. The sensor circuit board as described in claim 1 further includes: a plurality of suspension wire frames surrounding the movable stage and not in direct contact with it, the plurality of suspension wire frames being arranged in concentric circles; a plurality of first connectors for connecting the movable stage and the plurality of suspension wire frames; and a plurality of second connectors for connecting the plurality of suspension wire frames and the outer frame.

3. The sensor circuit board as claimed in claim 2, wherein a plurality of grooves are provided between the plurality of suspension frames, the plurality of grooves being disposed between the plurality of suspension frames and having a plurality of metal plating on one side of each of the grooves.

4. The sensor circuit board as described in claim 3, further comprising: A protective film is applied to the multiple grooves; The protective film has multiple grooves, each cut along the direction of each groove, with a circular hole formed at each end of each groove.

5. A method for manufacturing a sensor circuit board, comprising: A flexible substrate is provided, having a first upper surface and a first lower surface relative to the first upper surface; The step of forming the flexible substrate includes: providing a first flexible circuit structure having a first metal layer and a second metal layer opposite to the first metal layer; A second flexible circuit structure is provided, having a third metal layer; and an adhesive layer is used to bond the first flexible circuit structure and the second flexible circuit structure, wherein the adhesive layer is located between the second metal layer and the second flexible circuit structure; a support substrate is provided, having a second upper surface and a second lower surface opposite to the second upper surface; a photosensitive element is disposed on the first upper surface; a magnetic sensing sheet is disposed on the first lower surface; a coil layer is disposed on the second upper surface, wherein the coil layer overlaps with the magnetic sensing sheet; a movable stage is formed; a frame adhesive is disposed between the flexible substrate and the support substrate, and surrounds the four edges of the movable stage; and a cavity is formed between the flexible substrate, the support substrate and the frame adhesive; and the movable stage is disposed within an outer frame.

6. The method for manufacturing the sensor circuit board as described in claim 5 further includes: Multiple suspension frames are formed around the movable platform; multiple first connecting members are connected between the movable platform and the multiple suspension frames; And connecting multiple second connectors to the multiple suspension frames and the outer frame.

7. A method for manufacturing a sensor circuit board as described in claim 6, wherein the step of forming the plurality of suspension frames includes: Multiple metal-plated holes are provided on the flexible substrate; The plurality of metal-plated holes are connected to form a plurality of trenches, and the plurality of hole walls of the plurality of metal-plated holes are respectively retained on one side of each trench; A protective film is applied over the multiple grooves; And cut the protective film along the direction of the plurality of grooves to form a plurality of grooves, and form a circular hole at each end of each of the grooves.

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