Masking and laser processing methods
TW202638161APending Publication Date: 2026-09-16SHIN ETSU CHEMICAL CO LTD +1
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Patent Information
- Application Number
- TW115107144
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-02-28
- Filing Date
- 2026-02-26
- Publication Date
- 2026-09-16
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Abstract
This invention relates to a mask for laser processing, comprising: a synthetic quartz substrate having a first side and a second side opposite to the first side; and a patterned light-shielding film having: a metal-containing film formed on the first side of the synthetic quartz substrate; and a metal film formed on the metal-containing film, wherein the compositions of the metal-containing film and the metal film are different from each other, and the reflectivity of the metal-containing film is 40% to 80% when irradiated by laser from the second side of the synthetic quartz substrate. This provides a mask that exhibits excellent durability in laser processing.
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